제원

사용설비 :
사용공정 : CMP, CVD,ETCH
Wafer Size : 300mm
사용환경 :
반복 정밀도 : ± 0.1mm 이내
Robot의 특징 : Scara Blade 3axis
 

Repair Ass’y

CMP FI Robot 3NS411
Producer FI Robot 3N200mm Arm
CMP FI Controller 3NS411
Producer FI Controller 3NS410
 

Repair Knowhow

Blade Flatness Test
Wafer Transfer Test
Motion Range Confirmation
Input/output Signal Confirmation
Motion Repetition Test with Laser Sensor
Hand Unit Linier Test with Laser Microscope
 
Repair Process
 
 
 
 
 
 
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